SMT Laser Stencil (LPKF G6080)
Delivering up to 1µm accuracy with German LPKF G6080 laser cutting, vacuum nano-coating, and 50+ Beijing Jingdiao CNC engraving machines. Supporting leading EMS & PCB manufacturers across India & global markets.





































Founded in 2018 in Greater Noida and expanded to Chennai in 2021, Rijin Electronics Pvt. Ltd. (日进电子) is committed to delivering world-class SMT stencils and tooling fixtures with guaranteed precision, consistent quality, and prompt on-time delivery.
Our engineering teams utilize industry-leading German LPKF G6080 laser systems and 50+ high-precision CNC engraving machines across over 4,000 square meters of production space. We specialize in addressing complex modern SMT assembly challenges—from ultra-fine pitch 01005 components to multi-level step stencils and flexible PCB magnetic holding fixtures.
LPKF G6080 laser cutting with 1µm accuracy ensures perfect aperture release.
Same-day delivery for standard stencils and 24/7 technical support.
Patented AI Copper Mesh eliminates slow dispensing needles.
Optical aperture measurement and tension verification for every unit.
From automated CAM design optimization to precision laser cutting, CNC milling, and rigorous quality assurance, our 4 pillars ensure unmatched reliability.
Automated CAD/CAM engineering for Gerber file verification, aperture optimization, DFM analysis, and custom fixture design tailored to customer PCB requirements.
Equipped with German LPKF G6080 laser cutting systems and 50+ Beijing Jingdiao CNC engraving machines across 4,000+ sqm facilities. Micron-level tolerances with capacity for 400+ fixtures daily.
Strict quality control at every stage. 100% final inspection with optical coordinate measurement, aperture wall roughness verification, and mesh tension testing for zero defects.
Rapid engineering response across Greater Noida and Chennai corridors. On-site technical support, urgent same-day stencil replacement, and dedicated customer success engineers.
Engineered to meet the most exacting standards of high-density SMT printing, flexible circuit holding, and automated assembly.
Manufactured using state-of-the-art German LPKF G6080 laser cutting technology. Features ultra-smooth aperture sidewalls with optimal trapezoidal cross-sections to ensure superior solder paste release, exceptional repeatability, and dramatic reduction in defects such as bridging and solder balls.
| Laser Accuracy | Ultra-high precision up to 1µm (±0.001 mm) |
| Foil Material | Imported High-Tension SUS304 Stainless Steel Foil |
| Foil Thickness | 0.02 mm to 0.30 mm |
| Frame Dimensions | 29" x 29" (736x736mm), 23" x 23" (584x584mm), or Custom Sizes |
| Mesh Tension | High-strength imported polyester mesh > 35 N/cm |
SMT Laser Stencil (LPKF G6080)
Engineered specifically for combined AI (Auto-Insertion) and SMT production lines. By replacing traditional glue needle dispensing with high-speed stencil printing of red glue, Rijin's AI Copper Mesh dramatically shortens production cycles and reduces operational costs.
AI Copper Mesh Assembly
Engineered for PCBs containing mixed components requiring different solder volumes (e.g., fine-pitch QFNs alongside large connectors, RF shield cans, or uneven flexible circuits). Combines chemical step-etching, LPKF precision laser cutting, and hydrophobic vacuum nano-coating.
| Manufacturing Process | Chemical Etching + Precision Laser Cutting (蚀刻+激光切割) |
| Material Grade | SUS304 Fine-Grain Austenitic Stainless Steel |
| Foil Thickness Range | 0.02 mm – 0.30 mm (Variable Multi-Step Thickness) |
| Surface Treatment | Vacuum Hydrophobic & Oleophobic Nano-Coating |
| Best Suited For | Uneven FPCs, Shield frames, Component mixed-pitch pads |
FG Step Nano Stencil
Engineered to provide rigid, stable positioning for PCBs during high-speed SMT pick-and-place and reflow soldering processes. Prevents board warpage, absorbs thermal expansion stresses, and ensures consistent component placement accuracy. Manufactured using synthetic stones (Durostone/Ricocel) and ESD-safe alloys.
| Manufacturing Facility | 50+ Beijing Jingdiao / DONGDA High-Speed CNC Machines |
| Daily Capacity | 400+ Precision Fixtures per day |
| Materials Used | Synthetic Stone (Durostone), Bakelite, ESD Acrylic, Aviation Aluminum |
| Applications | Main Board, Sub Board, Wave Soldering Pallet, Depaneling Nests |
SMT Main Board Fixture
Tailored for ultra-thin Flexible Printed Circuits (FPC) and delicate dispensing operations. Utilizes permanent neodymium magnet clamping systems to maintain absolute flatness without adhesive tapes. Dispensing fixtures guarantee uniform glue height and zero spillage on sensitive components.
| FPC Holding Tech | High-Coercivity Magnetic Clamping Matrix (强磁平整吸附) |
| Dispensing Control | Precise uniform adhesive depth & anti-overflow nests |
| Other Fixture Types | PCB Depaneling Fixtures, Cleaning Fixtures, Press-fit Tooling |
| Maintenance | Wear-resistant coating for easy flux & glue cleanup |
FPC Magnetic Clamping Jig
Custom contoured nests for multi-up small sub-boards, preventing micro-vibrations during chip shooter placement.
Fabricated with premium Durostone for superior thermal shock resistance, protecting SMT chips during wave soldering.
High-durability routing nests that eliminate flexural stresses during PCB separation, guaranteeing intact solder joints.
Operating across Greater Noida and Chennai, our production facilities house German LPKF G6080 laser systems, 50+ Beijing Jingdiao CNC engraving machines, and cleanroom tensioning suites.
The benchmark in SMT stencil laser cutting worldwide. Achieves 1µm positioning precision, ultra-clean aperture cuts, and fine-pitch cutouts down to 01005 chips.
Fleet of 50+ high-precision CNC engraving machines dedicated to rapid turnaround of SMT fixtures, wave pallets, and magnetic jigs. Daily capacity exceeding 400 fixtures.
Every single stencil and fixture produced at Rijin Electronics undergoes exhaustive coordinate measuring, aperture sidewall inspection, and tension verification before dispatch.
High-magnification automated optical measurement compares cut apertures against original Gerber CAD data to guarantee 100% dimensional adherence.
Multiple-point pneumatic tension measurement guarantees uniform frame tension across the entire printable surface for zero paste bleeding.
Precision laser beam tuning ensures ultra-smooth aperture sidewalls, maximizing solder paste release efficiency to over 95%.
Every shipment includes a certified QA report detailing stencil tension, key pad dimensions, and foil thickness measurements.
Measurable engineering advantages that translate into higher production yield, shorter turnaround times, and reduced rework overhead.
German LPKF G6080 laser cutting guarantees sub-micron repeatability, razor-sharp aperture geometry, and perfect solder release volume down to 01005 ultra-fine pitch pads.
Innovative stencil printing of SMD red glue directly replaces slow dispensing needles, crushing assembly cycle time bottlenecks.
Near-zero solder balls, bridging, and tombstoning drastically lower manual touch-up and scrap costs after reflow.
With full-scale manufacturing facilities in Greater Noida (North) and Chennai (South), we guarantee same-day local dispatch and 24-hour turnaround across India's primary electronics corridors.
Our continuous Beijing Jingdiao CNC cluster easily accommodates high-mix, mega-volume mobile phone, automotive, and industrial PCB ramps.
Every single stencil is measured via high-magnification optical scanners and dispatched with a certified inspection report. In the rare event of variance, we remake and deliver immediately.
We warmly welcome long-term cooperation and business partnerships with electronics manufacturers, EMS leaders, and PCB innovators across India and globally.
Plot no- H-01, B-1, 2nd Floor & 3rd Floor, DMIC Integrated Industrial Township, Greater Noida, Gautam Buddha Nagar, UP - 201310, India.
Chennai Electronic Manufacturing Corridor, Tamil Nadu, India. Serving automotive electronics and consumer electronics giants across South India.
Directly connect with our chief technical officer and sales engineers for immediate consultation, DFM reviews, or on-site visits.